Climatic Reliability of Electronics: Global Challenges and Perspectives
– The 5th International Seminar
5-6 March 2020
DTU Lyngby
Meeting room 1
Anker Engelundsvej 1
2800 Kgs. Lyngby
During the past couple of decades, use of electronics have increased in gigantic proportions. Use of power electronics in various sectors is a typical example as well as electrification of automotive sector. The device needs to be highly reliable for use in various climatic conditions. Humidity can cause reliability issues in electronics resulting in intermittent malfunctions and permanent failures; many of them are due to transient water film formation on PCBA surface under climatic exposure. Therefore understanding, finding preventive measures, and design for humidity robustness is important. There can be extrinsic methods keeping humidity level low or intrinsic methods increasing the robustness of the PCBA and components. As such preventive measures can be individually or used in combination.
Following previous years successful seminars, we are pleased to announce the 5th international seminar on climatic reliability of electronics. The two days seminar will cover various aspects of humidity issues in electronics elucidating failure mechanisms, influencing factors, humidity and climate modelling, and various preventive measures. This is a focused seminar with invited talks delivered by experts in various areas from industry and academia on various issues.
There will be extended focus on networking between participants during the evening programmes. The seminar attracts delegates from academia and industry. We are delighted to invite you to attend this important seminar.
Seminar topics intended to cover, but not limited to:
- Corrosion reliability issues of electronics and failures mechanisms
- Humidity Issues related to low power and higher power electronics
- Humidity effects on PCBA: Material, component, design, and process aspects
- Electronic component level reliability issues
- Enclosure aspects in controlling humidity issues
- Moisture modelling and climate modelling for humidity effects prediction
- Preventive measures: Intrinsic reliability of PCBA, coatings, and extrinsic methods to control humidity in the device
Organizers:
Professor Rajan Ambat, CELCORR, Technical University of Denmark
Dr. Morten Jellesen, CELCORR, Technical University of Denmark
Day 1 - Thursday 5 March 2020 |
Session 1 - Humidity interaction with PCBA and failure mechanisms | |||||
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Session 1 – Humidity interaction with PCBA and failure mechanisms |
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Registration and light breakfast | |||||
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Overview of the seminar, and perspectives on the humidity effects on electronics Rajan Ambag, CELCORR, DTU, Denmark |
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Corrosion behavior of printed electronics with silver traces Laura Frisk, Trelic, Finland |
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Corrosion investigations on Bi and Mn micro-alloyed lead-free SAC alloys Bálint Medgyes, BME, Budapest, Hungary |
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Coffee break | |||||
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Session 1 (continued) – Humidity interaction with PCBA and failure mechanisms |
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Electrochemical corrosion and thermal effects at voltages ≥ 12 V in electronics systems Nicolas Mayer, Automotive Electronics Robert Bosch, Germany Nicolas Mayer will give his talk on Skype |
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Carbonization of PCB material in relation to thermal incidents Lutz Müller, Automotive Electronics Robert Bosch, Germany Lutz Müller will give his talk on Skype |
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Lunch | |||||
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Session 2 – Importance of process and service related residues |
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Interaction of PCBA Materials and flux systems: Reliability assement Daniel Buckland, Henkel Ltd., United Kingdom Daniel Buckland will give his talk on Skype |
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Does the measurement of ionic contamination predict reliability? Realization of IPC-J-STD001G-Am1 in the automotive Industry Lothar Henneken, Automotive Electronics Robert Bosch, Germany |
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A validation tool for SMT-flux residues by infrared-spectroscopy based multi variate data analysis Theresia Richter, Automotive Electronics Robert Bosch, Germany |
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Chemical composition, evolution, deliquescence and conductivity of aerosol deposited on the insulators of the Italian national power lines Luca Ferrero, University of Milan Biccoca, Italy Luca Ferrero will give his talk on Skype |
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Coffee break | |||||
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Session 3 – Humidity and reliability of high power/low power systems and components |
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Studies on sprayed metal (schoopage) as humidity barrier in film capacitor Lucia Cabo, TDK Electronics Components, Spain |
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Beyond humidity testing: Mixed Flowing Gas Tests on Power Electronics Tommi Kärkkäinen, LUT University in Lappeenranta, Finland |
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Humidity-induced failures in state-of-the-art power semiconductor devices Christian Zorn, University of Bremen, Germany |
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First day summary and bus transport to the dinner location | |||||
Day 2 - Friday 6 March 2020 |
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Arrival and coffee Session 3 (continued) – Humidity and reliability of high power/low power systems and components |
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Comparison of PCBs and DBCs concerning ECM and formation of dendrites Chen Weiyi, Fraunhofer Institute for Integrated Systems and Device Technology IISB, Germany |
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Field failures of electronics and power capacitors in railway application: Breakdowns related to environmental conditions and proposed countermeasures Roland Schmid, Bombardier Transportation, Zurich |
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Study of the degradation of different thermoelectric modules at Teide volcano Leyre Catalán Ros, Universidad Pública de Navarra, Spain |
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Challenges and requirements for reliable sinter interconnections Markus Meier, Zestron, Germany |
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Coffee break | |||||
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Session 4 – Humidity robustness testing, characterization methods and standards |
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Alternative Detection methods for Humidity Impacts on PCBAs Simone Lauser, Automotive Electronics Robert Bosch, Germany |
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Complementary EIS / FTIR study of the degradation of adhesives in electronic packaging Michael Schneider, Fraunhofer-Institut für Keramische Technologien und Systeme IKTS, Germany |
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Lunch | |||||
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Session 4 (Continued) Humidity robustness testing, characterization methods and standards |
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Component Specific Test Boards and Electrical Test Methods for Assessing the Climatic Reliability of PCBAs Mike Bixenman, Kyzen, USA |
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Reliability standards for cleanliness: protecting the future Emma Hudson, GEN3 Systems, United Kingdom |
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Session 5 – Extrinsic methods for prevention of humidity effects |
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Mission profiling and corrosion classification: importance in relation to humidity effects on electronics Morten Jellesen, CELCORR, Technical University of Denmark |
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Coffee break | |||||
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Ultra-thin Fluoropolymer Coating: Performance and Ese in Electronics Mélanie Mathon, Inventec Performance Chemicals, France Mélanie Mathon will give her talk on Skype |
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Moisture absorption by polymer materials and impact on enclosure design Helene Conseil, CELCORR, Technical University of Denmark |
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Conclusion and summary Rajan Ambat, CELCORR, Technical University of Denmark |
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Attendance fee
4,500 kr. for members of ATV-SEMAPP or CreCon
5,000 kr. for non-members
All prices are excluded of Danish VAT.
The fee covers conference materials, lunch, coffee, and conference dinner and social events.
Upon registration we will send you an invoice.
Binding registration
Registration is binding, however substitutions are accepted at any time. Please let us know.
Conference dinner 5 March 2020
The conference dinner will be at Restaurant Charlottenlund Fort, Strandvejen 150, 2920 Charlottenlund
This seminar is organized by
Centre for Electronic Corrosion (CELCORR), DTU
European Federation of corrosion (EFC), WP 23 on Corrosion Reliability of Electronics
European Centre for Power Electronics (ECPE)
