Climatic Reliability of Electronics:
Global Challenges and Perspectives
– The 8th International Seminar
16-17 March 2023
DTU Lyngby
Meeting Center – Meeting room 1
Anker Engelundsvej 1
2800 Kgs. Lyngby
Electronic systems are exposed to all types of environmental conditions today, as they are part of all technological applications. Power electronics are integral part of applications such as renewable energy, transportation and automotive electrification. All these systems are expected to perform in a robust and reliable manner under exposed climatic conditions.
Humidity and other environmental conditions such as gases can generate a number of electro chemical failure modes, leading to intermittent functional issues and complete systems failures. While it is important to understand the robustness and reliability of the systems under expected environmental conditions, and how that result in functional issues, an equally important aspect is the understanding of failure mechanisms and conditions and parameters causing such issues. Understanding detailed mechanisms and their connection to functional issues will allow better Pro-active design and maintenance strategies for effective control.
This seminar will focus on these issues addressing both electronics and electrical aspects together with material and corrosion aspects bringing together electronics/electrical and material/corrosion experts. Broadly, the seminar will address topics related to low/high voltage and effect of environmental conditions on failure mechanisms, technology sector wise issues, material, design, and PCBA processing aspects in connection with humidity issues, and intrinsic and extrinsic preventive strategies.
Topics for the seminar will cover, but not limited to:
- Electronics use for green transition technologies and issues related to exposure environment
- Environmental reliability issues related to Electrification in transportation
- Proper test methods for higher power/voltage electronics and challenges
- Material, corrosion and mechanistic aspects of failure modes
- Component level corrosion issues and failure mechanisms
- PCBA design and process connection to environmental reliability
- Intrinsic and extrinsic preventive measures including conformal coating, climate condition-based packaging etc.
Organizers:
Professor Rajan Ambat, CELCORR, Technical University of Denmark
Dr. Morten Jellesen, CELCORR, Technical University of Denmark
Registration:
Registration for the seminar is closed. If you have any questions, you can contact us: Tel.: +45 2724 2782, e-mail: atv-semapp@mek.dtu.dk
Day 1 - Thursday 16 March 2023 |
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Registration and coffee Session 1: Environmental issues of high power/low power systems, failure mechanisms, and testing |
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Introduction to the seminar and Importance of Environmental Effects on Electronics as a robustness and reliability issue Rajan Ambat, Center for Electronic Corrosion, Technical University of Denmark |
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High Humidity High Temperature and High Voltage Reverse Bias - A Required Test for Power Semiconductors in Industrial Applications Joonas Leppänen, ABB, Finland |
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Accelerated Corrosive Gas Testing under High Voltage for Power Semiconductor Modules Michael Hanf, University of Bremen, Germany |
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Coffee break | |||||
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Risk Prediction of Electrochemical Migration on Electronic Control Units – A Practical Approach Lothar Henneken, Robert Bosch, Germany |
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Paradigm shift in cooling systems: Reliability challenge in condensing application giving high RH for electronic components – a field case John B. Jacobsen and Preben Jakobsen, Grundfos, Denmark |
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Lunch break | |||||
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Session 1 (continued): Environmental issues of high power/low power systems, failure mechanisms, and Testing |
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Insights into the microclimate in IGBT modules during lab-based wind-energy converter system tests Christian Zorn, IWES, Fraunhofer Institute, Germany |
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Improvements on film capacitor performance under climatic stress Azahara Albendiz, TDK Electronics Components, S.A.U., Spain |
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Corrosion investigations on SAC-1Bi-xMn lead-free solder alloys Bálint Medgyes, BME Budapest, Hungary |
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Passivity of tin solder alloys Michael Schneider, Fraunhofer-Institut für Keramische Technologien und System IKTS, Germany |
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Coffee break | |||||
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CAF Failures & High Voltage Applications Angus Brunton, Isola GmbH, Germany |
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Overcoming corrosion-related challenges of passive component integration into overmolded packages Amar Mavinkurve, NXP Semiconductors, Netherlands |
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Development of a SIR test below 5V to Characterize ECM Graham Naisbitt, Gen3systems, UK |
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Corrosion-related activities in the European Power Electronics Network ECPE Thomas Harder, European Center for Power Electronics, Germany |
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First day summary and bus transport to the dinner location | |||||
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Seminar dinner | |||||
Day 2 - Friday 17 March 2023 |
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Arrival and coffee Session 2: Process cleanliness effect on corrosion reliability and optimization |
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Process cleanliness and safe boundaries for PCBA humidity robustness Rajan Ambat, CELCORR, DTU, Denmark |
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Electronic Soldering Material Reliability when exposed to Harsh Climatic Conditions Mike Bixenman, Magnalytix, USA |
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Optical inspection and SIR measuring under the component bodies using SIR Glass Test Vehicle Vladimír Sítko, PBT Works, Czech Republic and Mike Bixenman, Magnalytix, USA |
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Investigation of the effect of ionic contamination in thin gaps on assemblies close to reality with new miniaturized devices Helge Schimanski, Fraunhofer-Institut für Siliziumtechnologie ISIT and Thorsten Fladung, Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM, Germany |
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Coffee break | |||||
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Rust particles, are they able to cause shorts Lutz Mueller, Robert Bosch, Germany |
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UV LED conformal coating technologies Marie Kaing, ABChimie, France |
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Lunch break | |||||
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Session 3: Proper packaging and conformal coating for better protection from environmental effects |
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Integrated climate and CFD models for humidity effects verification on electronic packaging Max Peter Spooner, DTU-Compute and Sankhya Mohanty, DTU-Construct, Denmark |
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Humidity robustness of thermally stressed coatings Stefan Strixner, Zestron, Germany |
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An Efficient and Innovative Cleaning Solution with Low Environmental Impact Laura LECOMTE, Inventec Performance Chemical, France |
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Coffee break | |||||
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Plasma deposited thin halogen free conformal coating for corrosion protection of PCB Nicolas Vandencasteele, Europlasma NV, Belgium |
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Polyurethane coatings for PCBA protection against condensing conditions Ioannis Mantis, CELCORR, DTU, Denmark |
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A sustainable Nanocoating technology for corrosion protection of electronics and medical devices Rakesh Kumar, Specialty Coating Systems, USA |
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Conclusion and summary Rajan Ambat, CELCORR, Technical University of Denmark |
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Attendance fee
4,995 kr. for members of ATV-SEMAPP or CreCon
5,495 kr. for non-members
All prices are excluded of Danish VAT.
The fee covers conference materials, lunch, coffee and conference dinner.
Upon registration we will send you an invoice.
Binding registration
Registration is binding, however substitutions are accepted at any time. Please let us know.
Conference dinner 16 March 2023
The conference dinner will held at the historic and iconic restaurant Brede Spisehus.
Hotels near DTU
Zleep hotel Lyngby – approx. 500 meters from DTU
Scandic Eremitage – approx. 1,3 km from DTU
This seminar is organized by
Center for Electronic Corrosion (CELCORR), DTU
European Federation of corrosion (EFC), WP 23 on Corrosion Reliability of Electronics
European Center for Power Electronics (ECPE)
