Seminar:
Climatic Reliability of Electronics –
Challenges and Perspectives
– The 11th International Seminar
29-30 April 2026
| Marienlyst Strandhotel Nordre Strandvej 2A 3000 Helsingør Denmark |
Registration deadline has been extended to 21 April 2026
Seminar Announcement
Corrosion failures caused by exposure to harsh environments have become a dominant challenge for power electronics and other electronic systems. These issues arise due to demanding application conditions across various sectors making electronics exposed to harsh environmental conditions.
For the past 10 years, with the initiative of CELCORR group at DTU have organized this annual seminar to provide a common platform for discussing the multidisciplinary aspects of this topic, bringing together relevant stakeholders. Each year, the seminar has attracted participants from universities, research institutions, and industries worldwide, making it a great success.
Given the continued relevance of this subject – especially due to the use of low and high-power electronics in applications such as renewable energy, transportation, and automotive electrification under harsh climatic conditions, we are pleased to announce the 11th edition of this seminar.
Topics and program
The seminar will broadly address topics related to electronics and environmental exposure, including:
- Corrosion failure mechanisms including high voltage/power issues
- Material, design, and process aspects electronic parts contributing to corrosion
- Intrinsic methods for prevention making parts more robust against humidity
- Extrinsic strategies by climate resilient system design
- Modelling and use of AI-Analytics for corrosion prediction
- Sector-specific technological challenges
Our aim is to bring together experts in electronics/electrical engineering and materials/corrosion science from both academia and industry to tackle these critical issues collaboratively.
Program
Day 1 - Wednesday 29 April 2026 |
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Registration and breakfast | |||||
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Intro to 11th Edition of seminar and outlook on environment exposure related challenges for electronics Rajan Ambat, Center for Electronic Corrosion, Technical University of Denmark |
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Power Semiconductor Devices Under Humid Conditions Nando Kaminski, University of Bremen, Germany |
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Coffee & networking break | |||||
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Characterization of corrosive gas permeation through power electronics potting materials Juuso Rautio, LUT University, Finland |
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Atmospheric corrosion testing and classification of corrosivity: past, present, and future trends in corrosion and pollution Johan Tidblad, RISE, Sweden |
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Dewing on electronic devices - More robust than assumed Lothar Henneken, Robert BOSCH GmbH, Germany |
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Lunch | |||||
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Guided tour at Kronborg Castle 13:00: Bus transfer |
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Coffee and networking break | |||||
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Condensation in Sensorised Silicone Gel Potted Power Modules Tjark Djuren, University of Bremen, Germany |
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Harsh Electronic Climatic Research from the Lab to Industry Practice Mike Bixenman, Magnalytix, USA |
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From field exposure to failure prediction: a corrosion data–driven perspective on reliability of electronic systems Luntao Wang, University of Science and Technology Beijing, China |
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Dynamic humidity testing of SiC power semiconductors Oliver Schilling, Infineon, Germany |
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Summary of day 1 | |||||
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Break | |||||
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Welcome drink | |||||
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3-course seminar dinner in Restaurant Isabell (at the hotel) | |||||
Day 2 - Thursday 30 April 2026 |
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Welcome to day 2 | |||||
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PCBA Process Cleanliness Machine Design to Overcome Extremely Small Standoff Gaps Restricting Fluid Flow, Solvent Exchange, and Rinsing Efficiency Vladimir Sitko, PBT works, Czech Republic |
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Next Gen Materials, Next Gen Surface Structures: Redefining the Limits of PCB Design Michael Matthes, Würth Elektronik, Germany |
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Coffee and networking break | |||||
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Evaluating Conformal Coatings Ability to Protect During Condensation Testing Chris Hunt, GEN3, United Kingdom |
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Hygrothermal Cycling of Resin-Encapsulated Power Modules Christian Zorn, Mitsubishi Electric Europe, Germany |
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Coffee and networking break | |||||
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A holistic approach to reliability assessment of corrosion protection concepts for electronics Michael Schneider, Fraunhofer IKTS, Germany |
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Electrical vs electrochemical voltage and corrosion in electronics: Misconceptions and reality in relation results interpretation and testing Rajan Ambat, CELCORR, DTU Construct, Denmark |
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Lunch | |||||
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Some corrosion-related challenges in Flip Chip packages Amar Mavinkurve, NXP Semiconductors, Netherlands |
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Proposal for contamination limits on semiconductor top-surfaces Lutz Mueller, Bosch, Germany |
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Corrosion-oriented reliability testing of semiconductor components: current scenario, old and new challenges Alberto Mancaleoni and Andrea Olietti, STMicroelectronics, Italy |
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Coffee and networking break | |||||
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Digital design of PCB layout for humidity robustness: Coupled electrochemical-Predictive analytics modelling Anish Rao Lakkaraju and Sajjad Bahrebar, CELCORR, DTU Construct, Denmark |
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Investigation on dynamics of Sn dendrite formation during electrochemical migration failure Feng Li, China National Electric Apparatus Research Institute, China |
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Conclusion of seminar | |||||
The seminar includes a seminar dinner and a guided tour at Kronborg Castle – the legendary Renaissance fortress overlooking the Øresund. Known as Hamlet’s castle and it is a UNESCO World Heritage Site and one of Denmark’s most iconic landmarks.
Organizers
Local organizers
Professor Rajan Ambat, Center for Electronic Corrosion (CELCORR), Technical University of Denmark
Dr. Kapil Kumar Gupta, Center for Electronic Corrosion (CELCORR), Technical University of Denmark
Organizations involved in this seminar
Centre for Electronic Corrosion (CELCORR), DTU
European Federation of corrosion (EFC), WP23 on Corrosion Reliability of Electronics
European Centre for Power Electronics (ECPE)
Attendance fee
- 6,350 DKK for members of Teknologisk Videndeling, CreCon, DMN, IDA Mechanical, EFC or ECPE
- 6,950 DKK for non-members
All prices are excluded of Danish VAT.
The fee includes conference materials, lunch, coffee, and snacks during the seminar, as well as the seminar dinner on 29 April at Marienlyst Strandhotel. The fee does not include accommodation.
Registration
Binding registration
Registration is binding, however, substitutions are accepted at any time.
Please notify us by email at: teknologiskvidendeling@construct.dtu.dk
Invoicing information
It is possible to pay by credit card – the relevant information will be at the invoice. Please ensure your billing details are correct during registration.
Venue
Marienlyst Strandhotel
Nordre Strandvej 2A
3000 Helsingør
Denmark
Learn more about Marienlyst Strandhotel here.
Hotel rooms
Marienlyst Strandhotel
We recommend booking your room well in advance, as the hotel may have limited availability due to other guests. Reservations must be made directly with the hotel by contacting Lene Skov by this email: ls@marienlyst.dk.
Konventum
Konventum is a hotel located 2,6 km from Marienlyst. You can book rooms at Konventum HERE.
Public Transport to Marienlyst Strandhotel
You can travel easily from Copenhagen Airport to Marienlyst Strandhotel by public transport.
Plan your trip using the journey planner at https://www.publictransport.dk/journey-planner. Enter From: Københavns Lufthavn (or another departure point) and To: Marienlyst Strandhotel, Hotel, Helsingør Kommune to find the best connection by train, metro, or bus.
Kronborg Castle – the legendary Renaissance fortress overlooking the Øresund. Known as Hamlet’s castle, it is a UNESCO World Heritage Site and one of Denmark’s most iconic landmarks. As part of the seminar program, participants will enjoy a guided tour exploring its grand halls, ramparts, and rich history.
Promotion partners
(Picture of some of the participants from the 2025 seminar. We look forward to welcoming you at the 2026 seminar)
