Seminar:
Climatic Reliability of Electronics –
Challenges and Perspectives
– The 10th International Seminar
3-4 April 2025
Technical University of Denmark (DTU)
Meeting Center – Meeting room M1
Anker Engelunds Vej 1
2800 Kgs. Lyngby
Denmark
Registration deadline: 11 March 2025
About the seminar
Exposure environment caused corrosion failures are dominant today for Power Electronics and other electronic systems due to harsh application environments.
We are organizing this yearly seminar for the last 10 years consecutively with the goal of providing a common platform for discussing various aspects of this multidisciplinary topic with involvement of relevant stakeholders. Every year this seminar attracted many from universities, research institutions, and industries and was a great success with participants from all over the world.
Due to the continued interest and relevance of topic today because of the extensive use of power electronics and other electronics equipment as integral part in many applications such as renewable energy, transportation, and automotive electrification under harsh climatic conditions, we are organizing 10th version of this seminar on 3-4 April 2025.
Topics and program
Broadly, seminar will address topics related to electronics and climatic exposure related issues such as corrosion failure mechanisms, material-design-process aspects leading to corrosion effects, intrinsic and extrinsic preventive strategies, and technological sector wise issues. Aim is to bring together electronics/electrical and material/corrosion experts both from academia and industries to tackle various issues.
Preliminary program
A more detailed program and information will be announced soon.
Seminar hours: Day 1: 09:00-17:15, Day 2: 09:00-16:00
Thursday 3 April - Friday 4 April 2025 |
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Intro to seminar and challenges related to climate effects on electronics Rajan Ambat, Center for Electronic Corrosion, Technical University of Denmark |
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Solder Mask as a Reliable Insulation Layer on Printed Circuit Boards – Different Layouts and Materials under Humidity and High Voltage Michael Vogt, University of Bremen, Germany |
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Electrochemical investigation of thin-film encapsulation for electronic devices Michael Schneider, IKTS Fraunhofer, Germany |
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Influence of airborne particulate contamination on electronic hardware reliability Prabjit Singh, IBM Corporation, USA |
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Effect of halide contamination on the corrosion behavior of materials for microelectronic applications Florian Georges, INSA Lyon, France |
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A New Approach to Corrosion Detection and Analysis for Future Mobility Seungho Ahn, Hyundai R&D, South Korea |
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PCBA Reliability and Test for EV Applications – High-voltage PCBs and Aspects of Insulation Coordination Lothar Henneken , Bosch Automotive Electronics, Germany |
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Role condensed water film morphology on corrosion failure modes in electronics Anish Rao Lakkaraju/Jyothsna Rao, CELCORR, DTU, Denmark |
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Tailored Condensation Robustness Test for Pump with Electronics John Jacobsen & Preben Jakobsen, Grundfos, Denmark |
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Epoxy mold compounds for chips and some fails due to halide contamination Lutz Muller, Bosch Automotive Electronics, Germany |
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Effect of heating on dendritic corrosion growth in copper-alumina isolation trenches Juuso Rautio, LUT University, Finland |
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To be announced Vladimír Sítko, PBT Works, Czech Republicand Mike Bixenman, Magnalytix, USA |
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Climatic Reliability Assessment of Materials and Processes Mike Bixenman, Magnalytix, USA |
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Some elaboration on electrochemical migration failure mechanism, shorting, and electrical discharge Jyothsna Rao/Feng Li, CELCORR, DTU, Denmark |
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Corrosion related market issues in Hearing Aids Helene Conseil-Gudla, Demant A/S, Denmark |
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Phasing Out PFAS: BioHalo's Biobased Polymer Solution Alberto De Maria, BioHalo, Denmark. |
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A quantitative evaluation of a conformal coating’s capability to protect Printed Circuit Board assemblies from condensation Phil Kinner, MacDermidAlpha, United Kingdom |
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Overview of recent evolutions in ultrathin PFAS free coatings for electronics protections Nicolas Vandencasteele, Europlasma, Belgium |
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Design for Cleaning Vladimír Sítko, PBT Works, Czech Republic |
Organizers
Professor Rajan Ambat, Center for Electronic Corrosion (CELCORR), Technical University of Denmark
Dr. Kapil Kumar Gupta, Center for Electronic Corrosion (CELCORR), Technical University of Denmark
Attendance fee
- 6,100 DDK for members of Teknologisk Videndeling, CreCon, DMN, EFC or ECPE
- 6,700 DDK for non-members
All prices are excluded of Danish VAT.
The fee covers conference materials, lunch, coffee and conference dinner.
Registration
Register HERE
Binding registration
Registration is binding, however substitutions are accepted at any time. Please let us know by mail: teknologiskvidendeling@construct.dtu.dk
Conference dinner 3 April 2025
The seminar dinner will be held 3 April at 18:00 at The Odd Fellow Palace.
Hotels near DTU
– Zleep hotel Lyngby – approx. 500 meters from DTU
– Gentofte Hotel – approx. 6 kilometers from DTU
– Hotel Fortunen – approx. 3 kilometers from DTU
– Frederiksdal Sinatur Hotel & Konference – approx. 6 kilometers from DTU
Hotels near Nørreport station in Copenhagen
From Nørreport Station in Copenhagen, bus 150S (towards Kokkedal St.) provides a direct route to DTU. The bus journey from Nørreport Station to DTU (stop: Rævehøjvej) takes approximately 30 minutes, followed by a 5-minute walk to DTU from the bus stop.
– Ibsens Hotel (about a 6 minutes walk to Nørreport station, then approx. 30 minutes by bus to DTU)
– Hotel Kong Arthur (about a 6 minutes walk to Nørreport station, then approx. 30 minutes by bus to DTU)
Promotion partners
(Picture from the seminar in March 2024)