Climatic Reliability of Electronics –
Challenges and Perspectives

– The 9th International Seminar

21-22 March 2024

DTU Lyngby
Meeting Center – Meeting room 1
Anker Engelunds Vej 1
2800 Kgs. Lyngby

Registration deadline FRIDAY 15 March 2024

Today environmental conditions affect functionality of electronic systems, as they are part of all technological applications. Extensive use of power electronics as integral part in many applications such as renewable energy, transportation, and automotive electrification resulting in exposure to harsh climatic conditions and electrochemical/corrosion failure modes.

This is an yearly seminar focusing on the climate related issues of electronics bringing together electronics/electrical and material/corrosion experts. Broadly, seminar will address topics related to low/high voltage and effect of environmental conditions on failure mechanisms, technology sector wise issues, material, design, and PCBA processing aspects in connection with humidity issues, and intrinsic and extrinsic preventive strategies.

Seminar topics include, but not limited to:

  • Electronics use in renewable energy sectors and climate related issues.
  • Climatic issues related to electronic use in vehicle electrification.
  • Mechanisms and issues connected to high voltage/power and modification of failure mechanisms.
  • Test methods for simulating climatic effects and standardization.
  • Materials use in electronics and issues connected to corrosion.
  • Component level corrosion issues and failure mechanisms – High and Low power.
  • Effect of PCBA design and processing on climate robustness.
  • Intrinsic and extrinsic preventive measures including conformal coating, climate condition-based packaging etc.

Organizers:
Professor Rajan Ambat, CELCORR, Technical University of Denmark

 

 

 

Program

Day 1 - Thursday 21 March 2024

08:30 - 09:00
Registration and coffee

Session 1: Environmental issues of high power/low power electronic systems, failure mechanisms, and Testing

09:00 - 09:30
Intro to Seminar and Multidisciplinary aspects of climate effects on electronics and need of collaborative effort

Rajan AmbatCenter for Electronic Corrosion, Technical University of Denmark

09:30 - 10:00
Resin encapsulation technology used in Power Modules for environmental protection,

Shiori Idaka, Mitsubishi Electric Europe, Germany

10:00 - 10:30
Electrical Characteristics of Film Capacitors during HV-H3TRB Reliability Testing

Sven Clausner, University of Bremen, Germany

10:30 - 11:00
Coffee break
11:00 - 11:30
Premature power-converter failure in renewable energy applications - A case for application-specific system testing

Katharina Fischer, IWES Fraunhofer, Germany

11:30 - 12:00
Cyclic temperature and humidity profile in MFG testing of power electroncics

Juuso Rautio, LUT University, Finland

12:00 - 13:00
Lunch break
13:00 - 13:30
Influence of harmful gases on corrosion in power electronics

Victoria ZimmermannIISB Fraunhofer, Germany

13:30 - 14:00
Climate driven failure of a diode component and failure analysis

John B. Jacobsen & Preben Jakobsen, Grundfos, Denmark

14:00 - 14:30
Guideline Proposal for Creepage & Contact Distances in Automotive Electronics

Frank Luig, Forvia, Germany

14:30 - 15:00
Using the NFPA 921 Standard for a structured Analysis of a Fire involving ECM

Lutz MuellerRobert Bosch, Germany

15:00 - 15:30
Coffee break
15:30 - 16:00
Degradation studies of thermos transfer molds by EIS

Michael Schneider, IKTS Fraunhofer, Germany

16:00 - 16:30
A Systematic Corrosion Failure Analysis of Li-ion Powered Hearing Aids from Various Markets

Abhijeet Yadav, WS Audiology, Denmark

16:30 - 17:00
Multiphysics electrochemical modelling of humidity effects on electronics

Kristian Rye Jensen, COMSOL, Denmark

17:00 - 17:15
First day summary and bus transport to the dinner location
18:00 - 21:00
Seminar dinner

Day 2 - Friday 22 March 2024

08:00 - 08:30
Arrival and coffee

Session 2: External climate parameters and corrosion classification for electronics

08:30 - 09:00
Causal relationship between atmospheric aerosol electronic circuits: results from corrosion chamber studies

Luca Ferrero, University of Milano-Bicocca, Italy

09:00 - 09:30
Use of silver and copper coupons to better understand corrosivity of environments in electronics

Laura Frisk, Danfoss, Finland

09:30 - 10:00
Electronic Manufactured for Climate (ELMC) IFD project: Summary of project outcomes

Rajan Ambat, CELCORR, DTU, Denmark

Session 3: Process cleanliness effect on corrosion reliability and optimization of cleanliness

10:00 - 10:30
Data-driven models as well as analytical models to develop a mechanistic understanding of SIR data

Matthew KottwitzSandia National Laboratories, USA

10:30 - 11:00
Coffee break
11:00 - 11:30
Humidity Robustness of Electronic Control Units – The Hidden Factor Solder Resist

Lothar HennekenRobert Bosch, Germany

11:30 - 12:00
Designing for Reliability – Flux Residue Activity under Low Profile Components,

Vladimír SítkoPBT Works, Czech Republic and Mike BixenmanMagnalytix, USA

12:00 - 13:00
Lunch break
13:00 - 13:30
Solder Reflow Profile and its Effect on Flux Corrosiveness under Bottom Terminated Components

Mike BixenmanMagnalytix, USA and Vladimír SítkoPBT Works, Czech Republic

13:30 - 14:00
Enhanced SIR Requirements for Automotive e-Mobility

Karthik Vijay, Indium Corporation, Europe

Session 4:  Protection of different parts of electronics from corrosion using coatings

14:00 - 14:30
Systemic approach and corrosion protection in microelectronic devices

Bernard Normand, INSA Lyon/ST Microelectronics, France

14:30 - 15:00
Coffee break
15:00 - 15:30
Gel-state Coatings for High Performance and High Reliability Applications

Irina Rasid, ACTNANO, Germany

15:30 - 16:00
Minimizing Corrosion of Electrically Conductive Paint in Challenging Applications

Michael Strong, MG Chemicals, Canada

16:00 - 16:15
Conclusion and closing remark

Rajan Ambat, CELCORR, Technical University of Denmark

Attendance fee

  • 5,800 DDK for members of ATV-SEMAPP,CreCon, DMN, EFC or ECPE
  • 6,400 DDK for non-members

All prices are excluded of Danish VAT.
The fee covers conference materials, lunch, coffee and conference dinner.

Registration

Register – CLICK HERE

Binding registration
Registration is binding, however substitutions are accepted at any time. Please let us know by mail: teknologiskvidendeling@construct.dtu.dk

Conference dinner 21 March 2024
The seminar dinner will be held 21 March at 18:00 at

IDA Conference
Kalvebod Brygge 31-33
1780 København V

Hotels near DTU
Zleep hotel Lyngby  – approx. 500 meters from DTU

This seminar is organized by
Center for Electronic Corrosion (CELCORR), DTU
European Federation of corrosion (EFC), WP 23 on Corrosion Reliability of Electronics
European Center for Power Electronics (ECPE)