Climatic Reliability of Electronics: Global Challenges and Perspectives

Skrevet den af Teknologisk Videndeling

– The 6th International Seminar

4-5 March 2021
Online via MS Teams

Today, electronic systems are exposed to all climatic conditions depending on the place of use. Use of power electronics for various applications is a typical example, as well as the use of electronics in the automotive sector. The device needs to be highly reliable under extreme climatic conditions. Humidity can cause reliability issues in electronics resulting in intermittent malfunctions and permanent failures; many of them are due to transient water film formation on PCBA or on other components under climatic exposure. Therefore, knowledge based design for climatic reliability and developing preventive strategies are important. Irrespective of whether the system is low power or high power, basic mechanisms operating under humid conditions have many similarities. There are several possibilities for preventive measures based on extrinsic methods keeping low humidity level or intrinsic methods by increasing the robustness of the PCBA and components.

Following the previous years successful seminars, we are pleased to announce the 6th (virtual) seminar on climatic reliability of electronics. The two days seminar will cover various aspects of humidity issues in electronics. This is a focused seminar with only invited talks delivered by experts from industry and academia on various issues. We are delighted to invite you to attend this seminar.

Topics for the seminar will cover, but not limited to:

  • Corrosion reliability issues of electronics and failures mechanisms
  • Humidity Issues related to low power and higher power electronics
  • Humidity effects on PCBA: Material, component, design, and process aspects
  • Humidity issues related to electrification and e-mobility
  • Packaging design for climatic reliability
  • Moisture modelling and climate modelling for prediction of humidity effects
  • Preventive measures: Intrinsic reliability of PCBA, coatings, and extrinsic methods to control humidity in the device

Organizers:
Professor Rajan Ambat, CELCORR, DTU
Dr. Morten Jellesen, CELCORR, DTU

Thursday 4 March: Humidity interaction with electronic systems, components and mechanisms
09:30 - 10:00
Introduction to the seminar and humidity effects on electronics: where do we stand?

Rajan Ambat, Center for Electronic Corrosion, DTU
10:00 - 10:30
Humidity robustness of vehicle electronics – SIR-tests with superimposed self-heating

Lothar Henneken, Automotive Electronics, Robert Bosch, Germany
10:30 - 11:00
Analysis of dendritic corrosion phenomena on differently treated power electronic circuit

Victoria Zimmermann, Fraunhofer Institute, Erlangen, Germany
11:00 - 11:20
Coffee Break
11:20 - 11:50
Comparison between mixed flowing gas and flowers of sulphur corrosion testing

Laura Frisk, Trelic, Finland
11:50 - 12:20
Humidity and material induced failure mechanisms in low and high voltage electronics

Markus Meier, Zestron, Germany
12:20 - 13:20
Lunch Break
13:20 - 13:50
The role of carbonaceous material in conductivity: laboratory test and ambient data

Luca Ferrero, University of Milan Biccoca, Italy
13:50 - 14:20
Chloride containing Foreign Material in Epoxy Mold Compound

Lena Saier and Lutz Muller, Automotive Electronics, Robert Bosch, Germany
14:20 - 14:40
Coffee Break
14:40 - 15:10
Corrosion and humidity protection of next generation electronics through ultra-thin, organic coatings

Rakesh Kumar, Vice President of Technology, Specialty Coating Systems, Inc., USA
15:10 - 15:40
The Forensics of Dendrite Shorting

Terry Munson, Foresite, USA
15:40 - 15:50
Thursday summary

Friday 5 March: Humidity effect on electronics: Packaging, modelling humidity effects and testing
09:30 - 10:00
Key takeaways from an extrinsic corrosion mechanism during biased humidity tests in packages

Amar Mavinkurve, NXP Semiconductors, Netherlands
10:00 - 10:30
Water uptake evaluation in plastic packages: FEM simulation modeling and data comparison with Electrochemical Impedance Spectroscopy experimental approach

Sonia Morin, ST Microelectronics, Italy
10:30 - 11:00
Investigation of key influencing factors at automotive H2S-corrosion-testing

Jennifer Rieder, Osram, Germany
11:00 - 11:20
Coffee Break
11:20 - 11:50
Derivation of local humidity loads inside of vehicle electronics – simulation approach

Balazs Toth, Automotive Electronics, Robert Bosch, Germany
11:50 - 12:20
Critical level of water film build up for failure and modelling condensation

Helene Conseil Gudla & Alessandro Checchi, Mechanical Engineering, Technical University of Denmark
12:20 - 13:20
Lunch
13:20 - 13:50
Effect of humidity on flux residues and how to test for aggressivity of flux residues

Morten Jellesen, Mechanical Engineering, Technical University of Denmark
13:50 - 14:20
Advanced Humidity Testing under High Voltage

Michael Hanf, University of Bremmen, Germany
14:20 - 14:40
Coffee Break
14:40 - 15:10
Climate data analysis for humidity effects on electronics

Max Peter Spooner & Murat Kulahci, DTU Compute, Technical University of Denmark
15:10 - 15:40
Why the IEC 60529 water protection standard must be changed?

Michael Pecht, CALCE, University of Maryland, USA
15:40 - 15:50
Summary of seminar and concluding remarks

Registration fee

 DKK 1,595  Members of ATV-SEMAPP and promoting organizations
 DKK 1,995  Non-members

All prices are excluded of 25% Danish  VAT
The fee covers online participation and conference materials
Upon registration we will send you an invoice.

Binding registration
Registration is binding, however substitutions are accepted at any time. Just remember to send us an e-mail at atv-semapp@mek.dtu.dk to let us know who will be replacing you.

This seminar is organized by
Centre for Electronic Corrosion (CELCORR), DTU
European Federation of corrosion (EFC), WP 23 on Corrosion Reliability of Electronics
European Centre for Power Electronics (ECPE)